Intel unveils 13th Gen Intel Core family desktop processors
"We are raising the standards of PC performance once again with our latest generation of flagship 13th Gen Intel Core Processors," Michelle Johnston Holthaus, executive vice president and general manager of the Client Computing Group at Intel, said in a statement.
Qualcomm Snapdragon 8 Gen 2 may have ultra-high frequency variant
According to GSMArena, AQualcomm might launch two separate versions of the upcoming Snapdragon 8 Gen 2. The standard one will be business as usual, but there will also be a high-frequency iteration, which should push the clock speeds significantly higher. Currently, the Snapdragon 8+ Gen 1's Prime core runs at 3.19 GHz, while the high-frequency option will offer at least 3.4-3.5 GHz.
India must accelerate digitisation via chip design, innovation: Rajeev Chandrasekhar
After inaugurating Intel India's state-of-the-art design and engineering centre here, he said that Intel's critical contributions and relentless quest to advance innovation in design and engineering in the country over the past two and half decades highlights the design opportunity India offers to the world. "The inauguration of Intel's new state-of-the-art design facility in Bengaluru is a testament of its commitment to contribute towards bolstering India's technology leadership," the minister told the audience.
Intel plans to build $19 billion chip plant in Germany
Chipmaker Intel said it plans to build a semiconductor plant in Germany as part of an investment of up to 80 billion euros ($88 billion) in Europe over the next decade. The initial outlay for the facility in Magdeburg, the capital of Saxony-Anhalt, is 17 billion euros ($19 billion), reports TechCrunch. The company is also in discussions with Italy to build an Assembly and packing facility there at a cost of up to $4.9 billion.
Chip makers stare at fresh wave of uncertainty
With geopolitical tensions now extending from Asia to Europe and from semiconductor manufacturing to raw material supply, capacity expansion and investment decisions will have to be reevaluated, says Counterpoint Research. Palladium is used in component production, like for the substrate in PCB.
Leading chip makers establish universal chiplet standard
You will be able to customise chipset of your choice for your smartphone soon as leading chip-makers have formed a coalition to establish a universal chiplet interconnect express (UCIe) standard. Intel, Qualcomm, AMD, Arm, Samsung, Taiwan Semiconductor Manufacturing Company (TSMC), Meta, Microsoft, Google Cloud and others have launched new chip technology to establish a chiplet ecosystem and future generations of chiplet technologies.
MediaTek to release its first 6nm G-series chip in Q3: Report
Taiwanese chipmaking giant MediaTek is reportedly planning to release its first 6nm G-series chip by the third quarter of the year. The company is expected to release the new chip based on the highly advanced 6nm manufacturing process to replace the Helio G96, which in itself, is a quite popular chipset, reports GizmoChina. The new G-series 6nm chip will have two Cortex-A76 cores running above 2.0 GHz and six Cortex-A55 cores powering at 2.0 GHz.
Top 10 semiconductor buyers increased chip spending by 25% in 2021
Apple remained at the top of the semiconductor spending customer ranking in 2021, increasing its spending on memory by 36.8 per cent and on non-memory chips by 20.2 per cent in 2021. However, it decreased its demand for computing micro processing units (MPUs) due to the shift to its own in-house-designed application processors, according to the report.
Govt invites application under 'Chips to Startup' programme
The C2S programme aims to train 85,000 number of high-quality and qualified engineers in the area of Very large-scale integration (VLSI) and embedded system design as well as result in development of 175 ASICs (Application Specific Integrated Circuits), working prototypes of 20 System on Chips (SoC) and IP Core repository over a period of 5 years.