In a virtual address on Wednesday, Prime Minister Narendra Modi emphasized India's capacity for commitment and delivery, particularly highlighting the government's pledge to transform the nation into a semiconductor manufacturing powerhouse. The occasion marked the laying of the foundation stone for three semiconductor facilities, collectively valued at around Rs1.25 lakh crore, with two located in Gujarat and one in Assam.
Modi hailed the event as a momentous occasion propelling the nation towards a promising future. He underscored the significance of domestically-produced semiconductor chips, asserting their role in fostering self-reliance and embracing modernity. Reflecting on India's commitment to its goals, Modi reiterated the mantra that "When India commits, India delivers," highlighting the efficacy of democracy in achieving objectives.
In a veiled criticism of previous administrations, Modi noted how past governments were embroiled in scandals worth thousands of crores, yet failed to prioritize significant investments in the semiconductor industry's development.
The three projects unveiled on Wednesday encompass India's maiden Fab facility at Dholera, Gujarat, alongside Outsourced Semiconductor Assembly and Test (OSAT) facilities in Sanand, Gujarat, and Morigaon, Assam. These initiatives mark a pivotal step towards bolstering India's presence in the global semiconductor landscape.
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